The XC2V3000-4FF1152I, part of the Virtex-II series, remains a reliable option for engineers and system designers working with legacy FPGA applications. While it is no longer at the forefront of FPGA technology, it still offers a sufficient balance of logic density, embedded memory, and I/O flexibility. It continues to be suitable for industries such as telecommunications, industrial automation, and embedded systems that do not require the latest advancements in FPGA performance.At ANDESOURCE, we provide this component as part of our commitment to delivering one-stop solutions for electronic component needs, including fast delivery, expert guidance, stringent quality control, best price and dependable sourcing.
A Closer Look at XC2V3000-4FF1152I
Specification | Value |
Number of LABs/CLBs | 3584 |
Number of Gates | 3000000 |
Clock Frequency | 650MHz |
Number of Logic Cells | 32256 |
Total RAM Bits | 1769472 |
Number of I/O | 720 |
Voltage - Supply | 1.425V ~ 1.575V |
Mounting Type | Surface Mount |
Operating Temperature | -40℃ ~ 100℃ (TJ) |
Package / Case | 1152-BBGA, FCBGA |
Supplier Device Package | 1152-FCBGA (35mmx35mm) |
Key Strengths of the XC2V3000-4FF1152I
Solid Logic Density for Legacy Designs
The XC2V3000-4FF1152I offers 3 million system gates and 32,256 logic cells, providing a capable solution for mid-range to moderately complex digital designs. While this was impressive when the FPGA was first released, it remains a strong option for legacy applications or projects where cutting-edge performance is not required. The architecture is well-suited for systems needing a balance of logic density and flexibility, such as telecommunication systems and industrial control applications.
Optimized Embedded Memory for Legacy Applications
With 1.7 Mbits of embedded memory, the XC2V3000-4FF1152I can support applications that require moderate local data storage and buffering, making it suitable for certain legacy systems or less memory-intensive embedded applications.
I/O Flexibility for Legacy Interfacing
The XC2V3000-4FF1152I supports 720 user-configurable I/O pins, allowing it to interface with a variety of legacy protocols. While it doesn't support modern high-speed I/O standards such as PCIe Gen 3 or high-speed transceivers, it is well-suited for systems that rely on traditional I/O standards. This makes it an ideal choice for embedded systems and industrial automation where newer, faster, modern I/O capabilities are not critical.
Sufficient Speed for Time-Dependent Applications
Operating at a clock frequency of 650 MHz, the XC2V3000-4FF1152I is capable of meeting the needs of many time-dependent applications, particularly in legacy systems where performance requirements are less demanding by today's standards. Although modern FPGAs can achieve speeds well beyond 1 GHz, the 650 MHz of this device is sufficient for applications where high-frequency operation is not a critical factor, such as industrial control, medical equipment, and some communications systems.
Robust Packaging for Reliable Operation
The 1152-BBGA FCBGA package provides effective heat dissipation and improved signal integrity, making the XC2V3000-4FF1152I a reliable choice for systems requiring stable electrical performance and thermal management. The flip-chip BGA package is well-suited for surface-mount applications in compact or thermally constrained systems, providing good reliability for industrial or embedded systems.
Wide Temperature Range for Harsh Environments
Designed to operate in a wide temperature range of -40°C to 100°C, the XC2V3000-4FF1152I can withstand challenging environmental conditions. This makes it a suitable option for industrial-grade applications, automotive electronics, and aerospace systems that require a rugged, reliable device able to function in harsh environments.
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