XCZU9EG-L1FFVB1156I
XCZU9EG-L1FFVB1156I
XCZU9EG-L1FFVB1156I
XCZU9EG-L1FFVB1156I
  • Embedded - System On Chip (SoC) XCZU9EG-L1FFVB1156I
  • Embedded - System On Chip (SoC) XCZU9EG-L1FFVB1156I
  • Embedded - System On Chip (SoC) XCZU9EG-L1FFVB1156I
  • Embedded - System On Chip (SoC) XCZU9EG-L1FFVB1156I
XCZU9EG-L1FFVB1156I
Category
Embedded - System On Chip (SoC)
Manufacturer
AMD Xilinx
RoHS
YES
Certification
Delivery
Payment

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Specifications
Data Sheet
TYPEDESCRIPTION
Part Number:XCZU9EG-L1FFVB1156I
Description:IC FPGA 328 I/O 1156FCBGA
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
SeriesZynq® UltraScale+™ MPSoC EG
Supplier Device Package1156-FCBGA (35x35)
Moisture Sensitivity Level (MSL)4 (72 Hours)
Speed500MHz, 600MHz, 1.2GHz
Manufacturer Standard Lead Time10 Weeks
Number of I/O328
Detailed DescriptionQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 599K+ Logic Cells 256KB 500MHz, 600MHz, 1.2GHz 1156-FCBGA (35x35)
ArchitectureMCU, FPGA
Meta Part NumberXCZU9EG-L1FFVB1156I-ND
Primary AttributesZynq®UltraScale+™ FPGA, 599K+ Logic Cells
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Flash Size-
Operating Temperature-40°C ~ 100°C (TJ)
RAM Size256KB
PackagingTray
PeripheralsDMA, WDT
Package / Case1156-BBGA, FCBGA
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

Data sheet: Work in prgress, stay tuned!

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