XCZU6EG-2FFVB1156E
XCZU6EG-2FFVB1156E
XCZU6EG-2FFVB1156E
XCZU6EG-2FFVB1156E
  • Embedded - System On Chip (SoC) XCZU6EG-2FFVB1156E
  • Embedded - System On Chip (SoC) XCZU6EG-2FFVB1156E
  • Embedded - System On Chip (SoC) XCZU6EG-2FFVB1156E
  • Embedded - System On Chip (SoC) XCZU6EG-2FFVB1156E
XCZU6EG-2FFVB1156E
Category
Embedded - System On Chip (SoC)
Manufacturer
AMD Xilinx
RoHS
YES
Certification
Delivery
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Specifications
Data Sheet
TYPEDESCRIPTION
Part Number:XCZU6EG-2FFVB1156E
Description:IC FPGA 328 I/O 1156FCBGA
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Number of I/O328
Package / Case1156-BBGA, FCBGA
PeripheralsDMA, WDT
Detailed DescriptionQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 469K+ Logic Cells 256KB 533MHz, 600MHz, 1.3GHz 1156-FCBGA (35x35)
Moisture Sensitivity Level (MSL)4 (72 Hours)
RAM Size256KB
Manufacturer Standard Lead Time10 Weeks
Primary AttributesZynq®UltraScale+™ FPGA, 469K+ Logic Cells
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
PackagingTray
Speed533MHz, 600MHz, 1.3GHz
Operating Temperature0°C ~ 100°C (TJ)
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Meta Part NumberXCZU6EG-2FFVB1156E-ND
ArchitectureMCU, FPGA
Flash Size-
Supplier Device Package1156-FCBGA (35x35)
SeriesZynq® UltraScale+™ MPSoC EG

Data sheet: Work in prgress, stay tuned!

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