Category
Embedded - System On Chip (SoC)
Manufacturer
AMD Xilinx
RoHS
YES
Delivery
Payment
| TYPE | DESCRIPTION |
| Part Number: | XCZU3CG-L2SFVA625E |
| Description: | IC FPGA 180 I/O 625FCBGA |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Series | Zynq® UltraScale+™ MPSoC CG |
| Peripherals | DMA, WDT |
| Number of I/O | 180 |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Package / Case | 625-BFBGA, FCBGA |
| Flash Size | - |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| RAM Size | 256KB |
| Detailed Description | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 154K+ Logic Cells 256KB 533MHz, 1.3GHz 625-FCBGA (21x21) |
| Speed | 533MHz, 1.3GHz |
| Manufacturer Standard Lead Time | 10 Weeks |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Meta Part Number | XCZU3CG-L2SFVA625E-ND |
| Architecture | MCU, FPGA |
| Packaging | Tray |
| Supplier Device Package | 625-FCBGA (21x21) |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
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