Category
Embedded - System On Chip (SoC)
Manufacturer
AMD Xilinx
RoHS
YES
Certification
Delivery
Payment
| TYPE | DESCRIPTION |
| Part Number: | XCZU19EG-L1FFVC1760I |
| Description: | IC FPGA 512 I/O 1760FCBGA |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Number of I/O | 512 |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Speed | 500MHz, 600MHz, 1.2GHz |
| Architecture | MCU, FPGA |
| Flash Size | - |
| Detailed Description | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells 256KB 500MHz, 600MHz, 1.2GHz 1760-FCBGA (42.5x42.5) |
| Manufacturer Standard Lead Time | 20 Weeks |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
| Supplier Device Package | 1760-FCBGA (42.5x42.5) |
| Meta Part Number | XCZU19EG-L1FFVC1760I-ND |
| Peripherals | DMA, WDT |
| Packaging | Tray |
| Series | Zynq® UltraScale+™ MPSoC EG |
| RAM Size | 256KB |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Package / Case | 1760-BBGA, FCBGA |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells |
Data sheet: Work in prgress, stay tuned!
