XCZU19EG-2FFVC1760I
XCZU19EG-2FFVC1760I
XCZU19EG-2FFVC1760I
XCZU19EG-2FFVC1760I
  • Embedded - System On Chip (SoC) XCZU19EG-2FFVC1760I
  • Embedded - System On Chip (SoC) XCZU19EG-2FFVC1760I
  • Embedded - System On Chip (SoC) XCZU19EG-2FFVC1760I
  • Embedded - System On Chip (SoC) XCZU19EG-2FFVC1760I
XCZU19EG-2FFVC1760I
Category
Embedded - System On Chip (SoC)
Manufacturer
AMD Xilinx
RoHS
YES
Certification
Delivery
Payment

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Specifications
Data Sheet
TYPEDESCRIPTION
Part Number:XCZU19EG-2FFVC1760I
Description:IC FPGA 512 I/O 1760FCBGA
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Number of I/O512
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature-40°C ~ 100°C (TJ)
Detailed DescriptionQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells 256KB 533MHz, 600MHz, 1.3GHz 1760-FCBGA (42.5x42.5)
ArchitectureMCU, FPGA
Package / Case1760-BBGA, FCBGA
Flash Size-
PeripheralsDMA, WDT
Speed533MHz, 600MHz, 1.3GHz
Moisture Sensitivity Level (MSL)4 (72 Hours)
Meta Part NumberXCZU19EG-2FFVC1760I-ND
Supplier Device Package1760-FCBGA (42.5x42.5)
Primary AttributesZynq®UltraScale+™ FPGA, 1143K+ Logic Cells
PackagingTray
SeriesZynq® UltraScale+™ MPSoC EG
RAM Size256KB
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Manufacturer Standard Lead Time20 Weeks

Data sheet: Work in prgress, stay tuned!

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