Category
Embedded - System On Chip (SoC)
Manufacturer
AMD Xilinx
RoHS
YES
Delivery
Payment
| TYPE | DESCRIPTION |
| Part Number: | XCZU15EG-2FFVB1156I |
| Description: | IC FPGA 328 I/O 1156FCBGA |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Packaging | Tray |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Detailed Description | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 747K+ Logic Cells 256KB 533MHz, 600MHz, 1.3GHz 1156-FCBGA (35x35) |
| Architecture | MCU, FPGA |
| RAM Size | 256KB |
| Speed | 533MHz, 600MHz, 1.3GHz |
| Peripherals | DMA, WDT |
| Number of I/O | 328 |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Supplier Device Package | 1156-FCBGA (35x35) |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Series | Zynq® UltraScale+™ MPSoC EG |
| Meta Part Number | XCZU15EG-2FFVB1156I-ND |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
| Manufacturer Standard Lead Time | 10 Weeks |
| Package / Case | 1156-BBGA, FCBGA |
| Flash Size | - |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
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