XC7Z100-2FFG900I
XC7Z100-2FFG900I
XC7Z100-2FFG900I
XC7Z100-2FFG900I
  • Embedded - System On Chip (SoC) XC7Z100-2FFG900I
  • Embedded - System On Chip (SoC) XC7Z100-2FFG900I
  • Embedded - System On Chip (SoC) XC7Z100-2FFG900I
  • Embedded - System On Chip (SoC) XC7Z100-2FFG900I
XC7Z100-2FFG900I
Category
Embedded - System On Chip (SoC)
Manufacturer
AMD Xilinx
RoHS
YES
Certification
ISO14001:2015 Certification ISO 45001:2018 Certification ISO 9001:2015 Certification
Delivery
Delivery
Payment
Payment

{{title}}
Price not available? Fill in the information below to send a quick RFQ, and we will respond promptly
{{ isClicked ? 'Submitted' : 'Submit RFQ' }}
Specifications
Data Sheet
TYPEDESCRIPTION
Part Number:XC7Z100-2FFG900I
Description:IC SOC CORTEX-A9 KINTEX7 900FBGA
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Package / Case900-BBGA, FCBGA
Primary AttributesKintex™-7 FPGA, 444K Logic Cells
Base Part NumberXC7Z100
PeripheralsDMA
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Flash Size-
RAM Size256KB
Meta Part Number122-2129-ND
Operating Temperature-40°C ~ 100°C (TJ)
ArchitectureMCU, FPGA
Detailed DescriptionDual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 444K Logic Cells 256KB 800MHz 900-FCBGA (31x31)
PackagingTray
Moisture Sensitivity Level (MSL)4 (72 Hours)
Number of I/O212
Manufacturer Standard Lead Time10 Weeks
SeriesZynq®-7000
Other Names122-2129
"######"XC7Z100-2FFG900I-ND
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed800MHz
Supplier Device Package900-FCBGA (31x31)

Data sheet: Work in prgress, stay tuned!

Close
2025 Sales


Info of submission


Email:ande