XC7Z045-2FFG676I
XC7Z045-2FFG676I
XC7Z045-2FFG676I
XC7Z045-2FFG676I
  • Embedded - System On Chip (SoC) XC7Z045-2FFG676I
  • Embedded - System On Chip (SoC) XC7Z045-2FFG676I
  • Embedded - System On Chip (SoC) XC7Z045-2FFG676I
  • Embedded - System On Chip (SoC) XC7Z045-2FFG676I
XC7Z045-2FFG676I
Category
Embedded - System On Chip (SoC)
Manufacturer
AMD Xilinx
RoHS
YES
Certification
ISO14001:2015 Certification ISO 45001:2018 Certification ISO 9001:2015 Certification
Delivery
Delivery
Payment
Payment

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Specifications
Data Sheet
TYPEDESCRIPTION
Part Number:XC7Z045-2FFG676I
Description:IC SOC CORTEX-A9 KINTEX7 676FBGA
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Flash Size-
Detailed DescriptionDual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 350K Logic Cells 256KB 800MHz 676-FCBGA (27x27)
RAM Size256KB
Number of I/O130
Meta Part Number122-1898-ND
SeriesZynq®-7000
Speed800MHz
Supplier Device Package676-FCBGA (27x27)
Manufacturer Standard Lead Time20 Weeks
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
Lead Free Status / RoHS StatusLead free / RoHS Compliant
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary AttributesKintex™-7 FPGA, 350K Logic Cells
Package / Case676-BBGA, FCBGA
Moisture Sensitivity Level (MSL)4 (72 Hours)
Other Names122-1898
PeripheralsDMA
Base Part NumberXC7Z045
PackagingTray
Operating Temperature-40°C ~ 100°C (TJ)
ArchitectureMCU, FPGA

Data sheet: Work in prgress, stay tuned!

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